
Data Sheet
SERIAL PRESENCE-DTECT MATRIX (continued)
Rev.1.2
09.11.2010
BYTE
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47-61
62
63
DESCRIPTION
ADDRESS AND COMMAND SETUP TIME, (t ISb )
ADDRESS AND COMMAND HOLD TIME, (t IHb )
DATA / DATA MASK INPUT SETUP TIME, (t DSb )
DATA / DATA MASK INPUT HOLD TIME, (t DHb )
WRITE RECOVERY TIME, (t WR )
WRITE to READ Command Delay, (t WTR )
READ to PRECHARGE Command Delay, (t RTP )
Mem Analysis Probe
Extension for Bytes 41 and 42
MIN ACTIVE AUTO REFRESH TIME, (t RC )
MINIMUM AUTO REFRESH TO ACTIVE /
AUTO REFRESH COMMAND PERIOD, (t RFC)
SDRAM DEVICE MAX CYCLE TIME, (t CKMAX )
SDRAM DEVICE MAX DQS-DQ SKEW TIME, (t DQSQ )
SDRAM DEVICE MAX READ DATA HOLD SKEW FACTOR,
(t QHS )
PLL Relock Time
Optional Features, not supported
SPD REVISION
CHECKSUM FOR BYTES 0-62
5300-555
0x20
0x27
0x10
0x17
0x3C
0x1E
0x1E
0x18
0x22
0x19
0x00
0x06
0x3C
0x7F
0x80
0x00
0x00
0x13
6400-666
0x17
0x25
0x05
0x12
0x3C
0x1E
0x1E
0x14
0x1E
0xE3
64-66
67
68-71
72
73-90
91
92
93
94
95-98
99-127
MANUFACTURER`S JEDEC ID CODE
MANUFACTURER`S JEDEC ID CODE (continued)
MANUFACTURER`S JEDEC ID CODE (continued)
MANUFACTURING LOCATION
MODULE PART NUMBER (ASCII)
PCB IDENTIFICATION CODE
IDENTIFICATION CODE (continued)
YEAR OF MANUFACTURE IN BCD
WEEK OF MANUFACTURE IN BCD
MODULE SERIAL NUMBER
MANUFACTURER-SPECIFIC DATA (RSVD)
0x7F
0xDA
0x00
xx
“ SEN01G64D1BF1SA-XX ”
x
x
x
x
x
0x00
128-255 Open for customer use
Part Number Code
0xff
S
1
E
2
N
3
01G
4
64
5
D1
6
B
7
F
8
1
9
SA
10
-
25
11
*
12
R
13
*RoHs compl.
Swissbit AG
SDRAM D DR 2
200 Pin Unbuffered 1.8V
Depth (1GB)
Width
PCB-Type (8231a)
* optional / additional information
Swissbit AG
DDR2-800MT/s
Chip Vendor (Samsung)
1 Module Rank
Chip Rev. F
Chip organisation x8
Industriestrasse 4
Ch-9552 Bronschhofen
Fon: +41 (0) 71 913 03 03
Fax: +41 (0) 71 913 03 15
www.swissbit.com
eMail: info@swissbit.com
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